Recycle of aluminum, aluminum secondary alloy ingot.
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چکیده
منابع مشابه
The piezoresistance of aluminum alloy interconnect structures
The effects of applied strain on the resistivity of Al thin film metallization interconnects have been measured with a novel methodology that uses thermal expansion mismatch to produce the strain. The interconnect volumetric strain is induced by thermal cycling of passivated and unpassivated interconnects between '70 and 373 K. The coefficient of piezoresistivity, defined as dr/dev, where r5res...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Light Metals
سال: 1992
ISSN: 0451-5994
DOI: 10.2464/jilm.42.464